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中国物理学会期刊

有机介质加载微波波导中二次电子发射对器件微放电阈值的影响

Impact of Secondary Electron Emission on Multipactor Threshold in Microwave Waveguides Loaded with Organic Dielectrics

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  • 微放电效应是空间高功率微波系统面临的重要可靠性问题,二次电子发射(SEE)是影响微放电发生的重要物理过程。为进一步揭示介质加载微波器件微放电特性及其物理机制,以聚四氟乙烯(PTFE)和聚酰亚胺(PI)填充的微波器件为研究对象,设计了一种工作于Ku频段的脊波导器件。分析了脊波导器件中微放电敏感区域表面微孔结构降低表面SEE能力的物理机制,证明在放电敏感区域介质表面构建微孔结构可有效降低二次电子产额(SEY),显著提升器件微放电阈值。采用飞秒激光加工技术在PTFE和PI表面制备了周期性百微米级阵列结构,SEY测试分析表明,微孔处理后PTFE的SEY峰值从2.1降至1.4,降幅达33.3%,第一临界能量(EP1)从40 eV提升至95 eV;PI的SEY峰值从1.4降至1.1,降幅为21.4%,EP1从65 eV显著提升至205 eV。微放电研究表明,单脊波导中微放电敏感表面经微孔处理后,填充PTFE或PI的器件微放电阈值分别提高至12374 W和12109 W,与未经处理的器件微放电阈值7734 W和7265 W相比,处理后器件的微放电阈值提升约5000 W。研究成果为高功率微波器件中介质低SEY表面研究提供了思路,在微波器件介质微放电抑制研究方面具有工程应用价值。

    Multipactor is a critical physical issue leading to performance degradation or even failure of space high-power microwave systems. This phenomenon typically occurs inside microwave devices, where free electrons resonate under continuous acceleration by radio frequency electric fields and undergo electron multiplication via secondary electron emission processes, ultimately triggering multipactor. This effect not only degrades component performance but can also cause failure of components or even entire spacecraft in severe cases. Dielectric microwave components, known for their high Q factor, low loss, and ease of miniaturization, are increasingly employed in space microwave systems. While the introduction of dielectric materials significantly enhances certain performance aspects of components, it also adds complexity to multipactor analysis to some extent. Unlike metallic components, when electrons collide with dielectric surfaces, they may accumulate a layer of positive or negative charges on the surface. The resulting quasi-static electric field, combined with the microwave electric field, influences the trajectory of electrons. In this work, by taking microwave ridge waveguide devices filled with polytetrafluoroethylene and polyimide as the research objects, we conducted device design, modeling, and multipactor threshold research. It analyzed the physical mechanism by which microporous structures on the surface of multipactor-sensitive areas in the device reduce the surface secondary electron emission capability. The study demonstrated that constructing microporous structures on the dielectric surface in discharge-sensitive regions can effectively reduce the secondary electron yield and significantly enhance the device's multipactor threshold. Periodic microporous arrays were fabricated on PTFE and PI surfaces using femtosecond laser processing technology. Morphological characterization, SEY testing, and multipactor threshold simulation analysis showed that the peak SEY of PTFE decreased from 2.1 to 1.4, a reduction of 33.3%, while the first crossover energy (EP1) increased from 40 eV to 95 eV. For PI, the peak SEY decreased from 1.4 to 1.1, a reduction of 21.4%, and EP1 significantly increased from 65 eV to 205 eV. The microporous structure raised the multipactor thresholds of PTFE- and PI-filled single-ridge waveguides to 12374 W and 12109 W, respectively, representing an improvement of approximately 5000 W compared to untreated surfaces. This research provides an effective technical approach for microstructural treatment of dielectric surfaces in high-power microwave devices, and holds significant engineering application value for anti-multipactor designs in various microwave systems.

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