A new magnetron sputtering method is tried by placing a magnet under the substrate during sputtering. Compared with the case without applied magnetic filed, we have found that the glow appearances and the film thickness distribution are changed greatly. The aspect of the glow above the substrate face vary with the magnet diameter. We make the glow appearances mechanism clear using the simulation of the magnetic field, and interpret the film thickness distribution as a result of the motion of the particles sputtered from the target in the special-distributed magnetic field.