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中国物理学会期刊

基于交错磁自旋劈裂的简化双层隧道结隧穿磁阻

Tunneling Magnetoresistance in a Simplified Bilayer Tunnel Junction Based on Altermagnetic Spin Splitting

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  • 新型交错磁材料打破了传统反铁磁隧道结的自旋简并限制,为开发新型自旋电子器件提供了新的机遇。然而,利用交错磁半导体在简化器件结构的同时保持高热稳定性和显著隧穿磁阻效应,仍是实现高密度存储器件的关键挑战。本文提出一种基于V2Se2O/Fe2B范德华异质结构的隧道结。该结构利用交错磁动量空间的自旋劈裂效应,克服了传统反铁磁隧道结因自旋简并无法实现隧穿磁阻的限制;同时,通过铁磁/交错磁界面的交换偏置效应有效提升铁磁层热稳定性,替代传统人工合成反铁磁钉扎层,显著简化器件结构。采用密度泛函理论结合非平衡格林函数方法的第一性原理计算表明,V2Se2O/Fe2B双层结构在室温下实现283%的隧穿磁阻效应,并具有通过材料掺杂或静电门控进一步优化性能的潜力。本研究所提出的V2Se2O/Fe2B简化双层磁隧道结,在显著降低结构复杂度的同时有效提升器件热稳定性,验证了交错磁材料在新型自旋存储器中的可行性与应用前景。

    Altemagnetic materials have recently broken through the spin degeneracy limitation of conventional antiferromagnetic tunnel junctions, offering new opportunities for developing novel spintronic devices. However, maintaining high thermal stability and significant tunneling magnetoresistance (TMR) while utilizing altemagnetic semiconductors to simplify device architecture remains a key challenge for achieving high-density storage devices. This work presents a tunnel junction based on a V2Se2O/Fe2B van der Waals heterostructure. By exploiting the spin-splitting effect in the momentum space of altemagnetic materials, this structure overcomes the inability to achieve TMR in conventional antiferromagnetic tunnel junctions due to spin degeneracy. Simultaneously, the exchange bias effect at the ferromagnetic/altemagnetic interface effectively enhances the thermal stability of the ferromagnetic layer, replacing the conventional synthetic antiferromagnetic pinning layer and significantly simplifying the device architecture. First-principles calculations based on density functional theory combined with non-equilibrium Green's function formalism demonstrate that the V2Se2O/Fe2B heterostructure achieves a TMR of 283% at room temperature, with further optimization potential through material doping or electrostatic gating. This study demonstrates the feasibility and application prospect of altemagnetic materials in next-generation spintronic memory devices, while substantially reducing structural complexity and enhancing thermal stability.

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