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Li Dan-Yang, Han Xu, Xu Guang-Yuan, Liu Xiao, Zhao Xiao-Jun, Li Geng-Wei, Hao Hui-Ying, Dong Jing-Jing, Liu Hao, Xing Jie.Bi2O2Se photoconductive detector with low power consumption and high sensitivity. Acta Physica Sinica, 2020, 69(24): 248502.doi:10.7498/aps.69.20201044 |
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Dong Gang, Wu Wen-Shan, Yang Yin-Tang.Stack-through silicon via dynamic power consumption optimization in three-dimensional integrated circuit. Acta Physica Sinica, 2015, 64(2): 026601.doi:10.7498/aps.64.026601 |
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Zhang Yan, Dong Gang, Yang Yin-Tang, Wang Ning, Wang Feng-Juan, Liu Xiao-Xian.A novel interconnect-optimal power model considering self-heating effect. Acta Physica Sinica, 2013, 62(1): 016601.doi:10.7498/aps.62.016601 |
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang.Resistometric study on electromigration failure in copper interconnects. Acta Physica Sinica, 2012, 61(24): 248501.doi:10.7498/aps.61.248501 |
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian.A microstructure-based study on electromigration in Cu interconnects. Acta Physica Sinica, 2012, 61(1): 018501.doi:10.7498/aps.61.018501 |
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He Liang, Du Lei, Huang Xiao-Jun, Chen Hua, Chen Wen-Hao, Sun Peng, Han Liang.Non-Gaussian analysis of noise for metal interconnection electromigration. Acta Physica Sinica, 2012, 61(20): 206601.doi:10.7498/aps.61.206601 |
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Zhang Jin-Song, Wu Yi-Ping, Wang Yong-Guo, Tao Yuan.Thermomigration in micro interconnects in integrated circuits. Acta Physica Sinica, 2010, 59(6): 4395-4402.doi:10.7498/aps.59.4395 |
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Zhu Zhang-Ming, Zhong Bo, Yang Yin-Tang.An accurate Joule heat model of RLC interconnect based on π equivalent circuit. Acta Physica Sinica, 2010, 59(7): 4895-4900.doi:10.7498/aps.59.4895 |
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Zhu Yi-Ming, Kaz Hirakawa, Chen Lin, He Bo-Yong, Huang Yuan-Shen, Jia Xiao-Xuan, Zhang Da-Wei, Zhuang Song-Lin.Terahertz power dissipation spectra of electrons in bulk GaAs under high electric fields at low temperature. Acta Physica Sinica, 2009, 58(4): 2692-2696.doi:10.7498/aps.58.2692 |
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Wu Zhen-Yu, Chai Chang-Chun, Li Yue-Jin, Liu Jing, Wang Jia-You, Yang Yin-Tang.The temperature characteristics of stress-induced voiding in Cu interconnects. Acta Physica Sinica, 2009, 58(4): 2625-2630.doi:10.7498/aps.58.2625 |
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Li Xin, Wang Janet M., Tang Wei-Qing.Stochastic collocation method for interconnect delay estimation in the presence of process variations. Acta Physica Sinica, 2009, 58(6): 3603-3610.doi:10.7498/aps.58.3603 |
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Zhu Zhang-Ming, Qian Li-Bo, Yang Yin-Tang.A novel interconnect crosstalk RLC analytic model based on the nanometer CMOS technology. Acta Physica Sinica, 2009, 58(4): 2631-2636.doi:10.7498/aps.58.2631 |
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Zhu Zhang-Ming, Zhong Bo, Hao Bao-Tian, Yang Yin-Tang.A novel temperature-aware distributed interconnect power model. Acta Physica Sinica, 2009, 58(10): 7124-7129.doi:10.7498/aps.58.7124 |
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Li Yue-Jin, Wang Jia-You, Liu Bin.The effect of via size on the stress migration of Cu interconnects. Acta Physica Sinica, 2008, 57(6): 3730-3734.doi:10.7498/aps.57.3730 |
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