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Abstract

A relation between grain size and metal film is given by combining the Marom model with experiment data. Based on available theory model, taking into account the surface scattering, boundary scattering and grain size effect, an analytical resistivity model is presented for the 1050 nm thick Cu films. In particular, within a range of 1020 nm, the findings show that the proposed model with consideration of grain size effects is in good agreement with experimental results. Compared with Lim, Wang and Marom' models, the proposed method can reduce the relative standard deviations by 74.24%, 54.85% and 78.29%, respectively.

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1.
Funds:Project supported by the National Natural Science Foundation of China (Grant No. 60606006) and the National Science Fund for Distinguished Young Scholars of China (Grant No. 60725415).

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Cited By

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Vol. 61, Issue 1 - 2012-01-05

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