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Abstract

The current controlled voltage source model of substrate parasitic resistance of deep sub-micron electrostatic discharge protection device is optimized by considering the effect of conductance modulation. A compact macro-model of substrate resistance is presented according to the characteristics of lightly doped bulk substrate and heavily doped substrate with a lightly doped epitaxial layer, which is scalable with the layout dimension. The experimental model parameters of devices with various spaces between source and substrate diffusion can be extracted by device simulation. The breakdown behavior of gate grounded negative-channel metal oxide semiconductor shows the effectiveness of this method. In the meantime, the simulation time-consuming of the compact model is only 7% that of the device simulation software.

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1.
Funds:Project supported by the National Defense Pre-Research Foundation of China (Grant No. 9140A23060111), the Fundamental Research Fund for the Central Universities, China (Grant No. K50510250002), and the Key Science and Technology Special Project of Shaanxi Province, China (Grant No. 2011KTCQ01-19).

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Cited By

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Vol. 62, Issue 4 - 2013-02-20

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